Circuit Electronic Industries Public Co., Ltd. or CEI in a short form, sub-manufacture of semiconductor packaging, enables improvements and performance by applying our expertise in the electrical, thermal and mechanical properties of materials and interconnect.
CEI began manufacturing activities in 1984 and continue to help our customers develop new products and engineering services, initial production ramp up as well as manufacture in volume. We believe that our customers are able to reduce the time-to-market and development costs of their semiconductors.
CEI is principally engaged in assembly and development activities related to a wide variety of JEDEC standard semiconductor packages; PDIP, PLCC, SOP, TSSOP, SSOP, MSOP, QFN, DFN, TO, SOT and multi-chip packaging. We also provide a niche process/product design and assembly for our customer specific application. CEI also enable capability for die visual inspection, functional testing and product rework service.